Infrared Imaging System Identifies Eight Micrometer Packaging Defects During High Speed Production

Infrared Imaging System Identifies Eight Micrometer Packaging Defects During High Speed Production

TechXplore Engineering reports that researchers at Fraunhofer IKTS have successfully integrated optical coherence tomography into packaging lines to identify microscopic seal failures. By utilizing near-infrared light, the OCTInline system generates three-dimensional maps of inte

TechXplore Engineering reports that researchers at Fraunhofer IKTS have successfully integrated optical coherence tomography into packaging lines to identify microscopic seal failures. By utilizing near-infrared light, the OCTInline system generates three-dimensional maps of inte