Biren Develops Near-Packaged Optics to Scale AI Clusters Beyond 1,000 GPUs

By Bojan Stojkovski · Interesting Engineering · 2026-07-18

Interesting Engineering reports that Chinese chip designer Biren is pivoting toward optical interconnects to bypass the physical constraints of copper-based server architecture. By utilizing near-packaged optics, the firm aims to link over 1,000 accelerators into a unified system

Interesting Engineering reports that Chinese chip designer Biren is pivoting toward optical interconnects to bypass the physical constraints of copper-based server architecture. By utilizing near-packaged optics, the firm aims to link over 1,000 accelerators into a unified system